Library, layout, analysis and DFX support

Build board-ready electronics with engineering checks inside the workflow.

SEPIC TECHNOLOGIES PRIVATE LIMITED supports hardware teams with PCB library support, layout design, analysis-led review, and fabrication-ready release packages. We have handled 26-layer boards so far and can evaluate higher complexity as future projects demand.

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Library Support PCB Design Analysis DFX 26-layer boards handled
Live board scene 3D stackup motion
Library Footprints ready
Layout 26 layers handled
Analysis Board risks mapped
DFX Release checked
0

layers handled so far

LIB

footprint and symbol support

PCB

layout and stack planning

DFX

assembly and fabrication review

Engineering confidence

Design decisions backed by simulation, review, and manufacturable layout detail.

Dense boards fail quietly until a prototype exposes crosstalk, rail droop, excessive temperature, or stack-up compromises. SEPIC helps teams make those issues visible early, tune the design, and release cleaner fabrication data.

Services

Specialized PCB services from library setup to release checks.

Close view of a printed circuit board footprint pattern 01

Library Support

PCB footprint creation, schematic symbols, pin mapping, land pattern checks, 3D model alignment, and reusable component data.

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Unassembled printed circuit boards arranged for fabrication 02

PCB Design

PCB layout design, placement, stack-up coordination, controlled routing, power planning, and manufacturing-ready outputs.

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Assembled circuit board with detailed surface-mount components 03

Analysis

Integrated board analysis delivered as one workflow with clear findings and layout-level fixes.

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Electronics prototype board connected for validation 04

Design For Assembly and Fabrication (DFX)

Fabrication checks, assembly review, panel notes, BOM sanity checks, pick-and-place readiness, and release documentation.

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Analysis workflow

Clear reports, practical fixes, and layout feedback your team can act on.

Every review is organized around the risks that matter: interface reliability, power stability, temperature rise, fabrication constraints, and the next design decision.

Critical net run PASS

DDR and high-speed nets checked against stack-up and spacing rules.

Power delivery sweep REVIEW

Rail noise flagged near connector cluster and regulator output plane.

Heat map FIXED

Thermal vias and copper expansion reduced local temperature rise.

Unassembled printed circuit boards with exposed pads
Stack-up, routing, and release files aligned before fabrication.
Assembled blue circuit board with surface-mount components
Analysis feedback tied directly to board-level design choices.

Process

From design files to focused engineering action.

01

Collect constraints

Schematics, PCB files, stack-up targets, interfaces, thermal limits, mechanical limits, and fabrication preferences.

02

Run targeted analysis

Analysis checks are scoped around the nets, rails, devices, and operating conditions that carry risk.

03

Resolve with layout

Findings are turned into routing, plane, via, component, stack-up, or decoupling recommendations.

04

Release confidently

Final packages include design outputs, review notes, and a clean path for prototype build or production handoff.

Capabilities

Support for demanding boards and practical release requirements.

Board complexity 2-26 layer rigid PCB layouts handled so far, with higher layer projects reviewed case by case.
Integrity domains Integrated analysis for board-level reliability, electrical margin, and heat-aware layout decisions.
Interfaces DDR, USB, Ethernet, LVDS, PCIe-style differential routing, SPI, I2C, UART, sensors, and power rails.
Deliverables Analysis reports, layout recommendations, Gerbers, drill data, assembly files, BOM support, and source files.
Software Tools Cadence Allegro, Altium Designer, PADS Professional, Siemens HyperLynx.

Applications

Built for products where electrical margins matter.

Industrial electronics

Control boards, power modules, sensor interfaces, IO cards, and rugged embedded systems.

High-speed digital

Processor boards, memory interfaces, communication modules, and dense connector-heavy layouts.

Power and thermal products

Boards with regulators, converters, current paths, heat-generating devices, and enclosure constraints.

Ready for review

Send your schematic, stack-up goals, or existing PCB files for a focused engineering review.

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Contact

Tell SEPIC what you are building.

Share the board type, layer count, interfaces, thermal limits, target timeline, and analysis scope. We will turn that into a clear next step.

  • Emailsales@sepic.in
  • Boards26-layer boards handled so far
  • AddressOJ Plex, No 1218, 2nd floor, 80 Feet Rd, 2nd Phase, BDA Lay Out, Chandra Layout, Bengaluru, Karnataka 560040, India