Design For Fabrication
Trace and spacing checks, drill constraints, copper balance, solder-mask review, board edge rules, panel notes, and stack-up communication.
Design For Assembly and Fabrication
DFX checks that make the board easier to fabricate, assemble, inspect, and revise.
SEPIC reviews design files through manufacturing eyes: fabrication constraints, assembly access, component orientation, panel needs, BOM readiness, and release documentation.
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Release readiness
Fabrication and assembly details reviewed before the package goes out.
Design For Assembly
Footprint orientation, component spacing, courtyard review, polarity clarity, pick-and-place readiness, and assembly drawing checks.
Release Package Review
Gerbers, drill data, centroid files, BOM review, assembly notes, fabrication notes, and source-file handoff consistency.
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